Product Summary
Mechanical Description:The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of
Direct Bonded Copper subsirate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.
The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads
Parametrics
VRRM range 400 to 1600 V
TSTG - 40 to 125 ℃
TJ - 40 to125℃
Features
Features
(1)High Voltage;
(2)Industrial Standard Package;
(3)Thick Al metal die and double stick bonding;
(4)Thick copper baseplate;
(5)UL E78996 approved;
(6)3500VRMS isolating voltage
Image | Part No | Mfg | Description | Pricing (USD) |
Quantity | |||||
---|---|---|---|---|---|---|---|---|---|---|
IRKT56/16A |
SCR DBL 2SCR 1600V 60A ADD-A-PAK |
Data Sheet |
Negotiable |
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Image | Part No | Mfg | Description | Pricing (USD) |
Quantity | |||||
IRKT04 |
Other |
Data Sheet |
Negotiable |
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IRKT105/04A |
SCR DBL HISCR 400V 105A ADDAPAK |
Data Sheet |
Negotiable |
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IRKT105/04P |
Vishay Semiconductors |
SCR Modules 400 Volt 105 Amp |
Data Sheet |
Negotiable |
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IRKT105/06A |
SCR DBL HISCR 600V 105A ADDAPAK |
Data Sheet |
Negotiable |
|
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IRKT105/06P |
Vishay Semiconductors |
SCR Modules 600 Volt 105 Amp |
Data Sheet |
Negotiable |
|
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IRKT105/08A |
SCR DBL HISCR 800V 105A ADDAPAK |
Data Sheet |
Negotiable |
|