Product Summary

Mechanical Description:The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of
Direct Bonded Copper subsirate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.
The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads

Parametrics

VRRM   range 400 to 1600 V
TSTG - 40 to 125 ℃
TJ - 40 to125℃

Features

Features
(1)High Voltage; 
(2)Industrial Standard Package; 
(3)Thick Al metal die and double stick bonding; 
(4)Thick copper baseplate; 
(5)UL E78996 approved; 
(6)3500VRMS isolating voltage

Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
IRKT56/16A
IRKT56/16A


SCR DBL 2SCR 1600V 60A ADD-A-PAK

Data Sheet

Negotiable 
Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
IRKT170-12
IRKT170-12

Vishay Semiconductors

SCR Modules 1200 Volt 170 Amp

Data Sheet

Negotiable 
IRKT230-16
IRKT230-16

Vishay Semiconductors

SCR Modules 1600 Volt 230 Amp

Data Sheet

Negotiable 
IRKT250-16
IRKT250-16

Vishay Semiconductors

SCR Modules 1600 Volt 250 Amp

Data Sheet

Negotiable 
IRKT230-12
IRKT230-12

Vishay Semiconductors

SCR Modules 1200 Volt 230 Amp

Data Sheet

Negotiable 
IRKT250-14
IRKT250-14

Vishay Semiconductors

SCR Modules 1400 Volt 250 Amp

Data Sheet

Negotiable 
IRKT152
IRKT152

Other


Data Sheet

Negotiable